PRODUCTION
Equipments
MPM Hi-E Solder Printer
Flexi Mounter
Chip Shoote
Reflow Oven
Off-Line AOI
Off-Line Vacuum Vapor Phase Reflow
Report
- X-ray Report
- Inspection Report
- Testing Certification
- 8D Report
- Highly skilled production staffs and leaders
- Strategic factory location (vicinity to MNC & SMI factories)
- Adequate quality control measures and monitoring
- SMT assembly line is capable of handling 0201, fine pitch 0.3mm BGA, flexible PCB
- Innovated process to achieve reduction in manpower cost and production time with consistent quality
- Lead-Free & RoHS compliance
| LED Emitter attachment to MCPCB | Convention Reflow
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Cepco’s Vacuum Reflow
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| LCC with thermal pad attachment to PCB |  |
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